ELEXCON & ELENEX
Expodeck China · Shenzhen

ELEXCON & ELENEX

Dates
September 9, 2026 – September 11, 2026
Venue
Shenzhen World Exhibition & Convention Center (Bao'an)
Location
Shenzhen, China
Dates
September 9, 2026 – September 11, 2026
Venue
Shenzhen World Exhibition & Convention Center (Bao'an)
Location
Shenzhen, China

About This Expo

ELEXCON & ELENEX is a pivotal annual event for electronics and embedded technologies in South China, serving as a critical gateway to this dynamic market. This 23rd edition, co-located with CIOE and IICIE, offers an unparalleled platform for showcasing cutting-edge products and solutions. It targets a diverse audience including hardware developers, embedded engineers, procurement managers, and decision-makers across consumer electronics, automotive, communications, IoT, and industrial control sectors. For exhibitors, it provides immense exposure to over 240,000 professional visitors and 5,000+ exhibitors. Professional buyers benefit from efficient supplier screening, technical evaluation, and business negotiation within a compact three-day window. Attendees gain direct access to emerging technologies, foster connections with new industry partners, and acquire comprehensive insights through over 100 concurrent forums led by 1,000+ industry experts. The event facilitates targeted business connections, innovation display, procurement, and technical exchange across the full electronics industry chain.

Highlights

4 items
01
South China's Pivotal Electronics & Embedded Tech Event
As the 23rd edition, ELEXCON & ELENEX is a highly influential platform, co-located with CIOE and IICIE, attracting over 240,000 visitors and 5,000 exhibitors across 340,000 sqm.
02
Cutting-Edge Embedded AI & Semiconductor Innovations
Explore advancements in embedded AI, edge computing, memory, SoC/MCU/MPU, wireless tech, MEMS sensors, power management ICs, and advanced packaging solutions like SiP and Chiplet.
03
Over 100 Concurrent Forums & Expert Insights
Engage with 1,000+ industry experts in forums like the China Embedded Technology Conference, SiP Conference, and Automotive Electronics Sourcing Event, offering deep insights and networking.
04
Strategic Co-location with CIOE & IICIE
Co-located with China International Optoelectronic Exposition (CIOE) and International Integrated Circuit Innovation Exposition (IICIE), maximizing industry value chain exposure and synergy.
72,389
Attendees
545
Exhibitors
Net Area

FAQ

4 questions
The event is scheduled from September 9–11, 2026, at the Shenzhen World Exhibition & Convention Center (Bao'an).
Key sectors include Embedded AI & Edge Computing (MCUs, SoCs, sensors, AIoT) and Semiconductor IC & Advanced Packaging (SoC/MCU/MPU, power devices, MEMS, SiP, Chiplet).
The exhibition is projected to host over 5,000 exhibitors and attract more than 240,000 professional visitors, covering 340,000 square meters.
The event targets hardware developers, embedded engineers, procurement managers, and decision-makers across consumer electronics, automotive, communications, IoT, and industrial control.