IC Packaging Fair
Expodeck China · Shenzhen

IC Packaging Fair

Dates
October 27, 2026 – October 29, 2026
Venue
Shenzhen World Exhibition & Convention Center
Location
Shenzhen, China
Dates
October 27, 2026 – October 29, 2026
Venue
Shenzhen World Exhibition & Convention Center
Location
Shenzhen, China

About This Expo

The IC Packaging Fair serves as a premier one-stop purchasing platform dedicated to the IC packaging industry. This event is designed for professionals across the semiconductor sector, including those involved in IC design, manufacturing, packaging, and testing. Attendees will gain comprehensive insights into the entire IC packaging industry chain, from advanced materials and cutting-edge equipment to essential services and precise testing solutions. By showcasing a full spectrum of innovations, the fair offers unparalleled value for sourcing, networking, and staying abreast of the latest advancements. It's an essential gathering for industry experts looking to explore new technologies, connect with suppliers, and drive business growth within the dynamic IC packaging landscape.

Highlights

5 items
01
Comprehensive IC Packaging Focus
Showcases the entire IC packaging industry chain, including materials, equipment, services, and testing.
02
Key Exhibit Sectors
Explore dedicated zones for IC packaging materials, equipment, services, and testing solutions.
03
Targeted Semiconductor Audience
Attracts professionals from IC design, manufacturing, packaging, and testing sectors.
04
Concurrent Industry Events
Co-located with NEPCON Asia, Automotive World China, and ITES 2026 for broader industry insights.
05
One-Stop Sourcing Platform
Provides a convenient platform for sourcing and purchasing across the IC packaging ecosystem.

FAQ

5 questions
The fair will be held from October 27 to October 29, 2026, at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.
The event is organized by RX Huabo Exhibitions Co., Ltd.
The fair targets professionals from the semiconductor industry, specifically those involved in IC design, manufacturing, packaging, and testing.
Visitors can pre-register for the event to attend.
The core exhibit sectors include IC Packaging Materials, IC Packaging Equipment, IC Packaging Services, and IC Testing Equipment.